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International association of packaging research institutes

3SPack Packaging Chair


Chemical Engineering Department
Ecole Polytechnique of Montreal
CP 6079, Stn centre ville
Quebec H3C 3A7


Abdellah Ajji (Professor)

Other staff

Farhad Sadeghi (Research Associate)

Abdelghani Housni (Post doctoral fellow)

Melina Hamdine (Research associate)

Richard Silverwood (MScA Student)

Zahra Najarzadeh (PhD Student)

Naryam Freydoon (PhD Student)

Ramin Yousefzadeh (PhD Student)

Ali Saffar (PhD Student)


1-514-340-4711 ext 3703

3SPack NSERC Industrial Research Chair started in spring 2010. Its mission is to develop innovative, multilayer packaging using materials and films whose functional properties help improve safety. Detecting pathogens, reducing the amount of materials used and using biodegradable materials are other key concerns. The Chair aims to develop flexible multilayer packaging with added value for the environment and society. It is jointly funded by the Natural Sciences and Engineering Council of Canada (NSERC) and Industrial partners.


IAPRI 2018

The 21st IAPRI World Conference on Packaging will take place between 19-22 June in Zhuhai, China. It is hosted by Jinan University and Hunan University of Technology. For more information please click here

Latest News

IAPRI Extends the Deadline for the PepsiCo Student Exchange Scholarship for Research

IAPRI is pleased to announce that PepsiCo is sponsoring the 2018-2019 IAPRI Student Exchange Scholarship.

PepsiCo had stated this in support of the Scholarship: 'We believe this scholarship will provide a deserving student the critical skills and research experience in the field of packaging, needed for a successful career in a packaging or a consumer products company.'

The scholarship is $7,000 and 6 months with the objective of graduate students travel to a member organisation to undertake research that will enhance their work. We have a number of members who are interested in hosting students and we will help applicants contact potential hosts.

The deadline for submissions has beem extended until the 19th of March 2018. Full details will be found at